Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization

Journal of Materials Research

Volumn 22, Issue 3, 2007, Pages 735-741

  Wu, Albert T ^a   Hua, F ^b  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; ELECTRONICS PACKAGING; EUTECTICS; INTERFACIAL ENERGY; INTERMETALLICS; METALLIZING; SOLDERED JOINTS; SOLDERING ALLOYS;

COMPOSITE SOLDER; INTERFACIAL STABILITY; UNDER-BUMP METALLIZATION;

INTERFACES (MATERIALS);

EID: 33947223972     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0083     Document Type: Article

References (28)

1. International Roadmap for Semiconductor Technology (Semiconductor Industry Association, San Jose, CA, 1999).
2. R.R. Tummala and E.J. Rymaszewski: Microelectronics Packaging Handbook (Van Nostrand Reinhold, New York, 1989).
3. C.S. Chang, A. Oscilowski, and R.C. Bracken: Future challenges in electronics packaging. IEEE Circuits Devices Mag. 14, 45 (1998).
4. P.T. Vianco and D.R. Frear: Issues in the replacement of lead bearing solders. J. Met. 45, 14 (1993).
5. H.K. Kim and K.N. Tu: Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53, 16027 (1996).
6. H.K. Kim, K.N. Tu, and P.A. Totta: Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers. Appl. Phys. Lett. 68, 2204 (1996).
7. X.H. Wang and H. Conrad: Effect of Sn content of Pb-Sn solder alloys on wetting dynamics. Scr. Metall. Mater. 31, 375 (1994).
8. Z. Mei and J.W. Morris, Jr.: Characterization of eutectic Sn-Bi solder joints. J. Electron. Mater. 21, 599 (1992).
9. Y.J. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs, and R.F. Pinizzotto: The formation and growth of intermetallics in composite solder. J. Electron. Mater. 22, 69 (1993).
10. C.S. Huang, G.Y. Jang, and J.G. Duh: Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps. J. Electron. Mater. 33, 283 (2004).
11. M. Hansen: Constitution of Binary Alloys (McGraw-Hill, New York, 1958), p. 610.
12. K.N. Tu and R.D. Thompson: Kinetics of interfacial reaction in bimetallic Cu-Sn thin films. Acta Metall. 30, 947 (1982).
13. C.Y. Liu, K.N. Tu, T.T. Sheng, C.H. Tung, D.R. Frear, and P. Elenius: Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization. J. Appl. Phys. 87, 750 (2000).
14. Y. Taguma, T. Uda, H. Ishida, T. Kobayashi, and K. Nakada: Application of dc magnetron sputtered Cr-Cu-Au thin film for flip-chip solder terminal contacts, International Electronic Packaging Conference, Vol. 1 (International Electronic Packaging Society, Wheaton, IL, 1991), p. 619.
15. G.Z. Pan, A.A. Liu, H.K. Kim, K.N. Tu, and P.A. Totta: Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Ph content and eutectic PbSn solders. Appl. Phys. Lett. 71, 2946 (1997).
16. R. Shulda, V. Murali, and A. Bhansaliw: Flip chip CPU package technology at Intel: A technology and manufacturing overview, Proceedings of IEEE Electronic Compounds and Technology Conference (IEEE, San Diego, CA, 1999), p. 945.
17. P.G. Kim, J.W. Jang, T.Y. Lee, and K.N. Tu: Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils. J. Appl. Phys. 86, 6746 (1999).
18. K.N. Tu and K. Zeng: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. 34, 1 (2001).
19. 5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films. J. Appl. Phys. 80, 2774 (1996).
20. Y.C. Sohn, Yu. Jin, S.K. Kang, D.Y. Shih, and T.Y. Lee: Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization. J. Mater. Res. 19, 2428 (2004).
21. 3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing. J. Appl. Phys. 95, 8286 (2004).
22. L.Y. Hsiao and J.G. Duh: Characterizing metallurgical reaction of Sn-Pb solder with Ni/Cu under-bump metallization by electron microscopy. Thin Solid Films 469, 366 (2004).
23. G.Y. Jang, C.S. Huang, L.Y. Hsiao, J-G. Duh, and H. Takahashi: Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology. J. Electron. Mater. 33, 1118 (2004).
24. F. Zhang, M. Li, C.C. Chum, and Z.C. Shao: Effects of substrate metallization on solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles. J. Electron. Mater. 32, 123 (2003).
25. K. Zeng, R. Stiermand, T.C. Chin, D. Edwards, K. Ano, and K.N. Tu: Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005).
26. D. Li, C. Liu, and P. Paul: Conway, Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects. Mater. Sci. Eng., A. 391, 95 (2005).
27. M. He, Z. Chen, and G. Qi: Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization. Acta Mater. 52, 2047 (2004).
28. Y.D. Jeon, K.W. Paik, K.S. Bok, W.S. Choi, and C.L. Cho: Studies of electroless nickel under bump metallurgy - solder interfacial reactions and their effects on flip chip solder joint reliability. J. Electron. Mater. 31, 520 (2002).