Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 200-205

  Coyle, Richard J ^a   Serafino, Anthony J ^a   Solan, Patrick P ^b  

^a LUCENT TECHNOLOGIES   (United States)

^b Andrew Corporatiou   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BRITTLE FRACTURE; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; THERMAL CYCLING;

AREA ARRAY PACKAGES; BALL PULL TEST METHODS; BALL SHEAR; THERMAL PRECONDITIONING;

ELECTRONICS PACKAGING;

EID: 0036401045     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2002.1032754     Document Type: Article

References (45)

1. Xingjia Huang, S.-W. Ricky Lee, Chien Chun Yan, and Sam Hui, "Characterization and Analysis of the Solder Ball Shear Testing Conditions," Proceedings of the 51st ECTC, 1065-1071, Orlando, FL, May 29-June 1, 2001.
2. Richard J. Coyle and Patrick P. Solan, "The Influence of Test Parameters and Package Design Features on Ball Shear Test Requirements," Proceedings of the 26th IEEE International Electronics Manufacturing Symposium, 168-177, Santa Clara, CA, October 2-3, 2000.
3. ASTM F1269-89 "Test Methods for Destructive Shear Testing of Ball Bonds," 1991 Annual Book of ASTM Standards, Vol. 10.04, 1991, ASTM, Philadelphia.
4. Paul Walter, "Bond Testing Enters Mainstream PCB Assembly," Electrotechnology, Vol. 7, no. 3, 23-35, 1996.
5. Harry K. Charles, "Ball Bond Shear Testing: An Interlaboratory Comparison," Proceedings of the International Microelectronics Symposium, 265-274, October 6-9, 1986.
6. JESD22-B117, "Test Method for BGA Ball Shear," JEDEC 14.1 Test Methods Subcommittee, JEDEC Solid State Technology Association, Arlington, VA, July 2000.
7. M. Klein, B. Wiens, M. Huller, H. Oppermann, R. Aschenbrenner, H. Reichl, "Behaviour of Platinum as UBM in Flip Chip Solder joints," Proceedings of the 50th ECTC, 40-45, Las Vegas, Nevada, May 21-24, 2000.
8. Y. Tomita, Q. Wu, A. Maeda, S. Baba and N. Ueda, "Advanced Surface Plating on the Organic FC-BGA Package," Proceedings of the 50th ECTC, 861-867, Las Vegas, Nevada, May 21-24, 2000.
9. I. S. Kang, H. Kim, I. S. Park, K. R. Hur, S. J. Cho, H. Han and J. Yu, "The Solder Joint and Runner Metal Reliability of Wafer-Level CSP (Omega-CSP)," Proceedings of the 50th ECTC, 87-92, Las Vegas, Nevada, May 21-24, 2000.
10. S.-W. R. Lee, C. C. Yan, Z. Karim and X. Huang, "Assessment on the Effect of Electroless Nickel Plating on the Reliability of Solder Ball Attachment to the Bond Pads of PBGA Substrate," Proceedings of the 50th ECTC, 868-873, Las Vegas, Nevada, May 21-24, 2000.
11. S. Y. Jang and K. W. Paik, "Comparison of Electroplated Eutectic SnIBi and Pb/Sn Solder Bumps on Various UBM Systems," Proceedings of the 50th ECTC, 64-68, Las Vegas, Nevada, May 21-24, 2000.
12. S. J. Cho, Y. Kim, M. G. Park, I. S. Park and H. S. Chun, "Under Bump Metallurgies for a Wafer Level CSP with Eutectic Pb-Sn Solder Ball," Proceedings of the 50th ECTC, 844-849, Las Vegas, Nevada, May 21-24, 2000.
13. Andrew J. Mawer, "BGA Solder Ball Strength," Proceedings of the 6th Annual Electronics Packaging Symposium, SUNY Binghamton, July 14, 1995.
14. R. J. Coyle, T. I. Ejim, A. Holliday, P. P. Solan, and J. K. Dorey, "Reliability Performance and Failure Mode of High I/O Thermally Enhanced Ball Grid Array Packages," Proceedings of the 23rd IEMT, 323-332, Austin, TX, October 19-21, 1998.
15. T. I. Ejim, D. B,. Hollesen, A. Holliday, S. A. Gahr, R. J. Coyle, "Assembly and Reliability of Thermally Enhanced High I/O BGA Packages," Proceedings of the 21st IEMT Symposium, 25-31, Austin, TX, October 13-15, 1997.
16. Pat Johnson, Zequn Mei, Ali Eslambolchi, and Matt Kaufmann, "Acceptability and Monitoring Tests for Electroless Finish Quality on Laminate Substrates," Proceedings of SemiCon West 1999, G1-9, July 13-14, 1999.
17. Robert Erich, "Development and Implementation of Shear Testing for Surface Mount Area Array Technology," M. S. Thesis, SUNY Binghamton, 1998.
18. Robert Erich, Richard J. Coyle, George M. Wenger, and Anthony Primivera, "Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment," Proceedings of the 24th IEMT, 16-22, Austin, TX, October 18-19, 1999.
19. F. Gordon Foster, "Embrittlement of Solder by Gold from Plated Surfaces," ASTM STP 319, 13-19, 1962.
20. Z equn Mei, Pat Johnson, Matt Kaufmann, Ali Eslambolchi, "Effects of Electroless Ni/Immersion Au Plating Parameters on PBGA Solder Joint Attachment Reliability," Proceedings of the 49th IEEE Electronic Component and Technology Conference, 125-134, June 1-4, 1999.
21. Nicholas Biunno, "A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless Nickel/Immersion Gold Surface Finishes," Proceedings of the IPC Printed Circuits Expo 1999, Paper no. S18-5, March 14-18, 1999.
22. Donald Cullen, "Overview and Resolution of Electroless Nickel Immersion Gold Failure Modes," Proceedings of the IPC Printed Circuits Expo 1998, Paper no. S18-5, April 26-30, 1998.
23. F. D. Houghton, "Alternative Metallic Surface Finishes an Update on the ITRI/October Project," Proceedings of the IPC Printed Circuits Expo 1998, Paper no. S14-6, April 26-30, 1998.
24. Reza Ghaffarian, "Effects of Board Finish on Failure Mechanisms and Reliability of BGAs," Proceedings of Surface Mount International 1998, 23-27, San Jose, CA, 59-69, August 1998.
25. Karl Puttlitz, "Preparation, structures, and fracture modes of Pb-Sn and Pb-In terminated flip-chip attached to gold capped microsockets," IEEE Transactions-CHMT, volume 13, 647-655, 1990.
26. Don Cullen, Eric Huenger, Mike Toben, Bruce Houghton, and Kuldip Johal, "A Study on Interfacial Fracture Phenomenon of Solder Joints Formed Using the Electroless Nickel/Immersion Gold Surface Finish," Proceedings of IPC Works 2000, Paper no. S03-2, Miami, FL, September 9-14, 2000.
27. George M. Wenger, Richard J. Coyle, Patrick P. Solan, John K. Dorey, Courtney V. Dodd, Robert Erich, and Anthony Primavera, "Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects," Proceedings of the 26th International Symposium for Testing and Failure Analysis, 355-366, EDFAS/ASM International, November 12-16, 2000.
28. John H. Lau and Yi-Hsin Pao, "Failure Analysis," Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, Chapter 3, 47-89, McGraw-Hill, 1997.
29. Werner Engelmaier, "Solder Attachment Reliability, Accelerated Testing, and Result Evaluation," in Solder Joint Reliability: Theory and Applications, John H. Lau, editor, Van Nostrand Reinhold, 552, 1991.
30. Richard J. Coyle, Patrick P. Solan, Anthony J. Serafino, and Steven A. Gahr, "The Influence of Room Temperature Aging on Ball Shear Strength and Microstructure of Area Array Solder Balls," Proceedings of the 50th Electronic Component and Technology Conference, 160-169, Las Vegas, Nevada, May 21-24, 2000.
31. Robert Sykes, "Cold Bump Pull for BGA and Miniature BGA Packages," Dage Technical Informer, Dage Precision Industries, Ltd., England.
32. Ball Pull Test Module, BPTM-2K-13124, Royce Instruments, Napa, CA.
33. Richard J. Coyle, George M. Wenger, Diane E. Hodges, Andrew Mawer, Donald P. Cullen, and Patrick P. Solan, "The Effect of Variations in Nickel/Gold Surface Finish on the Assembly Quality and Attachment Reliability of a Plastic Ball Grid Array," Proceedings of the 51st ECTC, 1065-1071, Orlando, FL, May 29-June 1, 2001.
34. R. J. Coyle, A. Holliday, P. Mescher, P. P. Solan, S.A. Gahr, H. A. Cyker, J. K. Dorey, and T. I. Ejim, "The Influence of Nickel/Gold Surface Finish on the Assembly Quality and Long Term Reliability of Thermally Enhanced BGA Packages," Proceedings of the 24th IEMT Symposium, 23-35, Austin, TX, October 18-19, 1999.
35. Richard J. Coyle, Albert Holliday, Patrick P. Solan, Charlene Yao, Howard A. Cyker, John C. Manock, Ronald Bond, Ralph E. Stenerson, Robert G. Furrow, Michael V. Occhipinti, and Steven A. Gahr, "Solder Joint Attachment Reliability and Assembly Quality of a Molded Ball Grid Array Socket," Proceedings of the 51st ECTC, 1065-1071, Orlando, FL, May 29-June 1, 2001.
36. R. J. Coyle and P. P. Solan, unpublished research, Lucent Technologies Bell Laboratories, Princeton, NJ, May 2001.
37. Choung Hua Zhong and Sung Yi, "Solder Joint Reliability of Plastic Ball Grid Array," Soldering and Surface Mount Technology, Vol.11/1, 44-48, 1999.
38. Franz Cordes and Ron Huemoeller, "Electroless Nickel-Gold: Is There a Future?" Future Circuits International, Issue 4, 131-134, 1998.
39. Bernd Guenther, "Goldwire Bondable and Solderable Surfaces," Proceedings of the IPC Printed Circuits Expo 1999, Paper no. S13-3, March 14-18, 1999.
40. S. H.-K. Lee, E. Law, M. Papageorge and J. Wu, "Ball Attachment Evaluation for Tape Ball Grid Array Packages," Proceedings of Surface Mount International 1998, 46-53, San Jose, CA, August 23-27, 1998.
41. Z equn Mei, Matt Kaufmann, Ali Eslambolchi and Pat Johnson, "Brittle Interfacial Fracture of PBGA Packages on Electroless Ni/Immersion Au," Proceedings of the 48th Electronic Component and Technology Conference, 952-961, Seattle, WA, May, 25-28, 1998.
42. Z. Mei, P. Callery, D. Fisher, F. Hua, and J. Glazer, "Interfacial Fracture Mechanism of BGA Packages on Electroless Ni/Au," Advances in Electronic Packaging 1997, Proceedings of InterPack '97, Vol. 2, 1543-1550, ASME, 1997.
43. Edwin Bradley, Pradeep Lall, and Kingshuk Banerji, "Effect of Thermal Aging on the Microstructure and Reliability of Ball Grid Array (BGA) Solder Joints," Proceedings of Surface Mount International 1996, 95-106, San Jose, CA, September 10-12, 1996.
44. J.M. Jao, T.D. Her, C.P. Huang, E. Ho. Calub, R. H. Y. Lo, "Study of a New Structured Leadframe Based CSP, mini-LOC," Proceedings of the 50th ECTC, 364-369, Las Vegas, Nevada, May 21-24, 2000.
45. Bruce Houghton, "Results of BGA tensile Testing with Alternative Surface Finishes," Proceedings of the IPC SMEMA Council Apex 2001, Paper no. AT8-1, San Diego, CA, January 14-18, 2001.