Experimental studies of frequency characteristic on transducer power supply and vibration system in ultrasonic bonding system

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2006, Pages

  Zhou, Hongquan ^a   Han, Lei ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Bonding tool; Frequency characteristics; OTL power amplifier; Power supply; Ultrasonic bonding

Indexed keywords

DIGITAL SIGNAL PROCESSING; LINEAR SYSTEMS; POWER AMPLIFIERS; POWER SUPPLY CIRCUITS; TRANSFER FUNCTIONS; ULTRASONIC DEVICES;

BONDING TOOLS; FREQUENCY CHARACTERISTICS; OTL POWER AMPLIFIERS; ULTRASONIC BONDING;

TRANSDUCERS;

EID: 42749103195     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251440     Document Type: Conference Paper

References (3)

1. C.F.Luk,et al, "Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies,"Microeletronics Reliability,Vol. 12(2002), pp. 381-389.
2. th IEEE CMPT Conf, Shanghai, June.2004,pp.322-325.
3. S.F.Kang, et al. "Studies of thermosonic bonding for flip-chip assembly," Materials Chemistry and Physics, Vol.42 (1999), pp.31-37.