Experiments on the bonding interface vibration of thermosonic flip chip

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2006, Pages

  Wang, Fu Liang ^a   Han, Lei ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Bonding interface; Relatively vibration; Thermosonic flip chip

Indexed keywords

INTERFACES (MATERIALS); LASER APPLICATIONS;

BONDING INTERFACE; RELATIVELY VIBRATION; THERMOSONIC FLIP CHIP;

VIBRATION ANALYSIS;

EID: 37649027389     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251369     Document Type: Conference Paper

References (6)

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2. Tomioka Taizo, et al, "Thermosonic flip chip bonding for low cost packaging", 2002 International Symposium on Microelectronics, Denver, CO, United States,Sep,2002, pp.360-365.
3. Sa Yoon Kang, et al, "Thermosonic bonding for flip-chip assembly", Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95),Santa Cruz, CA, USA,Jan, 1995,pp.75-80.
4. Taizo Tomioka, Tomohiro Iguchi, Ikuo Mori, "Thermosonic flip-chip bonding for SAW filter", Microelectronics Reliability, Vol.44 (2004), pp. 149-154.
5. Mayer Michael, et al, "In-situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors",InterPACK '99: Pacific RJM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', Maui, HI, USA,Jun, 1999.pp.973-978.
6. J. Schwizer, et al, "Thermosonic Ball Bonding: Friction Model Based on Integrated Microsensor Measurements", Proc. 25th IEEE/CPMT Intl. Electronics Manufacturing Technology Symposium IEMT, 1999, pp. 108-114.