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Volumn 40, Issue 1-8, 2002, Pages 361-364

Complex vibration ultrasonic welding systems with large area welding tips

Author keywords

Complex vibration ultrasonic welding; Direct welding of semiconductor chip; Longitudinal torsional vibration converter; Packaging of electronic parts; Ultrasonic welding; Ultrasonics wire bonding

Indexed keywords

ALUMINUM; ELECTRONICS PACKAGING; SEMICONDUCTOR MATERIALS; TRANSDUCERS; VIBRATIONS (MECHANICAL);

EID: 0036565938     PISSN: 0041624X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0041-624X(02)00122-1     Document Type: Conference Paper
Times cited : (46)

References (3)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.