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Volumn 40, Issue 1-8, 2002, Pages 361-364
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Complex vibration ultrasonic welding systems with large area welding tips
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Author keywords
Complex vibration ultrasonic welding; Direct welding of semiconductor chip; Longitudinal torsional vibration converter; Packaging of electronic parts; Ultrasonic welding; Ultrasonics wire bonding
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Indexed keywords
ALUMINUM;
ELECTRONICS PACKAGING;
SEMICONDUCTOR MATERIALS;
TRANSDUCERS;
VIBRATIONS (MECHANICAL);
ULTRASONIC WIRE BONDING;
WELDING TIPS;
ULTRASONIC WELDING;
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EID: 0036565938
PISSN: 0041624X
EISSN: None
Source Type: Journal
DOI: 10.1016/S0041-624X(02)00122-1 Document Type: Conference Paper |
Times cited : (46)
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References (3)
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