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Volumn 26, Issue 8, 2005, Pages

Effect of different temperature on strength of thermosonic bonding

Author keywords

Bonding strength; Impedance of PZT; Power of PZT; Temperature; Thermosonic bonding process

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRIC IMPEDANCE; THERMAL EFFECTS; TRANSDUCERS;

EID: 25144457625     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (7)

References (8)
  • 1
    • 0036496928 scopus 로고    scopus 로고
    • Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
    • Luk C F, Chan Y C, Hung K C. Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies [J]. Microelectronics Reliability, 2002, 42(3): 381-389.
    • (2002) Microelectronics Reliability , vol.42 , Issue.3 , pp. 381-389
    • Luk, C.F.1    Chan, Y.C.2    Hung, K.C.3
  • 5
    • 1242306306 scopus 로고    scopus 로고
    • Reliability model for Al wire bonds subjected to heel crack failures
    • Ramminger S, Seliger N, Wachutka G. Reliability model for Al wire bonds subjected to heel crack failures [J]. Microelectronics Reliability, 2000, 40(8): 1521-1525.
    • (2000) Microelectronics Reliability , vol.40 , Issue.8 , pp. 1521-1525
    • Ramminger, S.1    Seliger, N.2    Wachutka, G.3
  • 6
    • 25144520920 scopus 로고    scopus 로고
    • Chinese source
  • 7
    • 25144462041 scopus 로고    scopus 로고
    • Chinese source


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.