Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding

Ultrasonics

Volumn 36, Issue 1-5, 1998, Pages 59-65

  Tsujino, Jiromaru ^a   Yoshihara, Hiroyuki ^a   Kamimoto, Kazuyoshi ^a   Osada, Yoshiaki ^a  

^a KANAGAWA UNIVERSITY   (Japan)

Author keywords

Ceramic capillary; Complex vibration wire bonding; Deformation of wire specimen; High frequency wire bonding; Temperature rise at welding surface; Ultrasonic wire bonding; Vibration distribution along ceramic capillary

Indexed keywords

BOND STRENGTH (MATERIALS); TEMPERATURE MEASUREMENT; VIBRATION MEASUREMENT;

CERAMIC CAPILLARY; THERMOELECTROMOTIVE FORCE; ULTRASONIC WIRE BONDING;

ULTRASONIC WELDING;

EID: 0031994321     PISSN: 0041624X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0041-624X(97)00075-9     Document Type: Article

References (3)

1. J. Tsujino, Recent development of ultrasonic welding, Proc. IEEE 1995 Ultrasonics Symp., IEEE, New York, 1996, pp. 1051-1060.
2. J. Tsujino, K. Hasegawa, Ultrasonic wire bonding using high frequency 330 kHz, 600 kHz and 780 kHz and complex vibration 190 kHz welding systems, Ultrasonics 34 (1996) 223-228.
3. J. Tsujino, K. Hasagawa, Y. Sone, K. Nozaki, Frequency characteristics of ultrasonic wire bonding using high frequency vibration systems of 40 kHz to 780 kHz, Proc. IEEE 1996 Ultrasonics Symp., IEEE, New York, 1997, pp. 1021-1026.