A simple transducer model for longitudinal flip-chip bonding

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2002, Pages 695-698

  Sattel, Thomas ^a   Brökelmann, Michael ^a  

^a UNIVERSITY OF PADERBORN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; DYNAMICS; ELECTRONICS PACKAGING; EQUATIONS OF MOTION; FLIP CHIP DEVICES; FREQUENCY RESPONSE; GALERKIN METHODS; MODELS; ULTRASONIC APPLICATIONS; VIBRATIONS (MECHANICAL); VISCOELASTICITY;

GALERKIN DISCRETIZATION; JUMP PHENOMENA; LONGITUDINAL FLIP CHIP BONDING; SOFTWARE PACKAGE MATLAB; VISCO-ELASTIC FOUNDATION MODEL;

ACOUSTIC TRANSDUCERS;

EID: 0036992433     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Tan, Quing; Longitudinal Thermosonic Bonding for Flip Chip Assembly, PhD-Thesis, University of Colorado at Boulder, USA, 1997
2. Babitsky, Vladimir I.; Krupenin, Vitaliy L.; Vibration of Strongly Nonlinear Discontinuous Systems, Springer-Verlag Berlin, 2001
3. Brökelmann, Michael; Modeling and Simulation of piezoelectric Actuators for Resonant Operation at Non-linear Mechanical Boundary Conditions, Master-Thesis, University of Paderborn, Germany, May 2002