Electron beam-treated organic monolayers as a negative resist for Cu immersion plating on Si

Journal of Solid State Electrochemistry

Volumn 8, Issue 10, 2004, Pages 772-777

  Balaur, E ^a   Zhang, Y ^a   Djenizian, T ^a   Schmuki, P ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Copper electroless deposition; DLC (diamond like carbon); Electron beam lithography; Organic monolayer nanopatterning; XPS surface analysis

Indexed keywords

1 DECENE; 1 OCTADECENE; 1 UNDECYLENIC ACID; 10 UNDECENOIC ACID; ALKENE DERIVATIVE; COPPER; HYDROGEN; ORGANIC COMPOUND; SILICON; UNCLASSIFIED DRUG;

ARTICLE; CHEMICAL MODIFICATION; CHEMICAL PARAMETERS; COVALENT BOND; ELECTROCHEMISTRY; ELECTRON BEAM; IMMERSION; IRRADIATION; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY;

EID: 4644308388     PISSN: 14328488     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10008-004-0544-7     Document Type: Article

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