Structural and electrical properties of Cu films deposited on glass by DC magnetron sputtering

Vacuum

Volumn 66, Issue 3-4, 2002, Pages 447-452

  Qiu, Hong ^a   Wang, Fengping ^a   Wu, Ping ^a   Pan, Liqing ^a   Tian, Yue ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Ar pressure; Cu film; DC magnetron sputtering deposition; Resistivity; Structure

Indexed keywords

ARGON; ATOMIC FORCE MICROSCOPY; COPPER; CRYSTAL ORIENTATION; ELECTRIC CONDUCTIVITY; EPITAXIAL GROWTH; FILM GROWTH; GLASS; GRAIN SIZE AND SHAPE; MAGNETRON SPUTTERING; PRESSURE EFFECTS; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; SURFACE ROUGHNESS; X RAY DIFFRACTION ANALYSIS;

SPUTTER-DEPOSITED FILMS;

THIN FILMS;

EID: 0037136205     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0042-207X(02)00169-0     Document Type: Article

References (20)