Microstructure and strain in electrodeposited Cu/Ni multilayers

Journal of Materials Research

Volumn 11, Issue 11, 1996, Pages 2825-2832

  Van Heerden, David ^a   Zolotoyabko, Emil ^b   Shechtman, Dan ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; DISLOCATIONS (CRYSTALS); ELECTRODEPOSITION; INTERFACES (MATERIALS); NICKEL; STRAIN; STRENGTH OF MATERIALS; STRESS RELAXATION; TRANSMISSION ELECTRON MICROSCOPY;

MODULATION WAVELENGTH;

METALLIC SUPERLATTICES;

EID: 0030285327     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.1996.0357     Document Type: Article

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