Surface energy characterization of partially-cured benzocyclobutene for 3D interconnect applications

ECS Transactions

Volumn 11, Issue 6, 2007, Pages 421-432

  McMahon, J J ^a   Gutmann, R J ^a   Lu, J Q ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; COPPER; CURING; INTEGRATED CIRCUIT INTERCONNECTS; INTERFACIAL ENERGY; SURFACE STRUCTURE; TEMPERATURE DISTRIBUTION;

BENZOCYCLOBUTENE; BONDING MATERIALS; COPPER INTERCONNECTS; ENERGY CHARACTERIZATION; MATERIAL PARAMETER; TECHNOLOGY PLATFORMS; TEMPERATURE DEPENDENCE; THREEDIMENSIONAL (3-D);

WAFER BONDING;

EID: 45749124774     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2778399     Document Type: Conference Paper

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