Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 584-588

  Labie, R ^a   Beyne, E ^a   Mertens, R ^a   Ratchev, P ^a   Van Humbeeck, J ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LEAD; TIN;

ALLOY FORMATION; PROCESS CONDITION; PURE SN; RELIABILITY BEHAVIOR; SMALL PITCH; SYSTEM LIFETIMES; THERMAL CYCLING TEST;

THERMAL CYCLING;

EID: 84867242461     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271588     Document Type: Conference Paper

References (6)

1. st Int. Conference on Pb-free Electronics 2003, pp. 81-85
2. Kejun Seng et al. "Interfacial reactions between Pb-free SnAgCu solder and Ni(P) surface finish on printed circuit boards", IEEE transactions on electronics packaging manufacturing, Vol. 25, No. 3, July 2002
3. Riet Labie et al., "Investigation of Co UBM for direct bumping on Cu/low k dies." Proceedings of the 53rd ECTC Conference 2003, pp. 1230-1234.
4. st Int. Conference on Pb-free Electronics 2003, pp. 171-178
5. st Int. Conference on Pb-free Electronics 2003, pp. 182-190
6. Bart Vandevelde, "Thermo-mechanical modeling of solder joint reliability for electronic package systems", PhD thesis KULeuven, Belgium, 2002