A chemical mechanical polishing model based on the viscous flow of the amorphous layer

Wear

Volumn 265, Issue 7-8, 2008, Pages 992-998

  Jiang, Jian Zhong ^a   Zhao, Yong Wu ^a   Wang, Yong Guang ^a   Luo, Jian Bin ^b  

^a JIANGNAN UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Amorphous layer; Chemical mechanical polishing; Nanometer contact; Polish pad properties; Viscous flow

Indexed keywords

AMORPHOUS MATERIALS; COMPUTER SIMULATION; MOLECULAR DYNAMICS; VISCOUS FLOW;

AMORPHOUS LAYER; NANOMETER CONTACT; POLISH PAD PROPERTIES;

CHEMICAL MECHANICAL POLISHING;

AMORPHOUS MATERIALS; CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; MOLECULAR DYNAMICS; VISCOUS FLOW;

EID: 44649086330     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2008.02.006     Document Type: Article

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