Full-wave solver for microstrip trace and through-hole via in layered media

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 2, 2008, Pages 292-302

  Ong, Chong Jin ^a,b   Wu, Boping ^a   Tsang, Leung ^a   Gu, Xiaoxiong ^a,c  

^a University of Washington   (United States)

^b MICRON TECHNOLOGY INC   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Electromagnetic analysis; Interconnections; Method of moments (MoM); Nonhomogeneous media

Indexed keywords

ELECTROMAGNETIC WAVES; GREEN'S FUNCTION; INTERCONNECTION NETWORKS; METHOD OF MOMENTS; NUMERICAL METHODS; SCATTERING PARAMETERS;

FOLDY-LAX MULTIPLE SCATTERING EQUATIONS; FULL-WAVE SOLVER; NONHOMOGENEOUS MEDIA;

MICROSTRIP LINES;

EID: 44449118545     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.920374     Document Type: Article

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