Application of the Foldy-Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards

Microwave and Optical Technology Letters

Volumn 49, Issue 1, 2007, Pages 225-231

  Ong, C J ^a   Miller, D ^b   Tsang, L ^a   Wu, B ^a   Huang, C C ^b  

^a University of Washington   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Ball grid arrays; Multiple scattering; Printed circuit boards; Signal integrity; Vias

Indexed keywords

BALL GRID ARRAYS; MULTIPLE SCATTERING; SIGNAL INTEGRITY;

COMPUTATION THEORY; NUMERICAL METHODS; PARAMETER ESTIMATION; PRINTED CIRCUIT BOARDS;

LIGHT SCATTERING;

EID: 33846021318     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.22091     Document Type: Article

References (7)

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