Study of package EMI reduction for GHz microprocessors

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 271-274

  He, Jiangqi ^a   Zhong, Dong ^a   Ji, Steven Yun ^a   Ji, Gang ^a   Li, Yuan Liang ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; DESIGN; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT DESIGN;

EMI REDUCTIONS; LOOP INDUCTANCE; OPERATING FREQUENCY; PACKAGE DESIGNS; PACKAGE DIMENSIONS; POWER PLANES; RELATIVE EFFICIENCY;

PACKAGING;

EID: 84862857120     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057930     Document Type: Conference Paper

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