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Volumn 46, Issue 5, 2005, Pages 446-452

Transmission and scattering on interconnects with via structures

Author keywords

Green's function; Interconnects; Layered medium; Scattering matrix; Trace; Vias

Indexed keywords

INTERCONNECTS; LAYERED MEDIA; SCATTERING MATRIX; TRACE; VIAS;

EID: 25144450704     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.21013     Document Type: Article
Times cited : (16)

References (11)
  • 1
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    • (1998) IEEE Symp IC/Package Design Integration
    • Fang, J.1    Zhao, J.2    Zhang, J.3
  • 2
    • 0028743752 scopus 로고
    • Coupled noise analysis for adjacent vias in multilayered digital circuits
    • Q. Gu, A. Tassoudji, S.Y. Poh, R.T. Shin, and J.A. Kong, Coupled noise analysis for adjacent vias in multilayered digital circuits, IEEE Trans Circ Syst 41 (1994), 796-804.
    • (1994) IEEE Trans Circ Syst , vol.41 , pp. 796-804
    • Gu, Q.1    Tassoudji, A.2    Poh, S.Y.3    Shin, R.T.4    Kong, J.A.5
  • 3
    • 0029309831 scopus 로고
    • Full-wave characterization of a through hole via in multi-layered packaging
    • S.G. Hsu and R.B. Wu, Full-wave characterization of a through hole via in multi-layered packaging, IEEE Trans Microwave Theory Tech 43 (1995), 1073-1081.
    • (1995) IEEE Trans Microwave Theory Tech , vol.43 , pp. 1073-1081
    • Hsu, S.G.1    Wu, R.B.2
  • 4
    • 0035813539 scopus 로고    scopus 로고
    • Modeling of multiple scattering among vias in planar waveguide using foldy-lax equations
    • L. Tsang, H. Chen, C. Huang, and V. Jandhyala, Modeling of multiple scattering among vias in planar waveguide using foldy-lax equations, Microwave Opt Technol Lett 31 (2001), 201-208.
    • (2001) Microwave Opt Technol Lett , vol.31 , pp. 201-208
    • Tsang, L.1    Chen, H.2    Huang, C.3    Jandhyala, V.4
  • 6
    • 0037358389 scopus 로고    scopus 로고
    • Analysis of large number of vias and differential signaling in multi-layered structures
    • H. Chen, Q. Li, L. Tsang, C.C. Huang, and V. Jandhyala, Analysis of large number of vias and differential signaling in multi-layered structures, IEEE Trans Microwave Theory Tech (2003), 818-828.
    • (2003) IEEE Trans Microwave Theory Tech , pp. 818-828
    • Chen, H.1    Li, Q.2    Tsang, L.3    Huang, C.C.4    Jandhyala, V.5
  • 7
    • 1242308466 scopus 로고    scopus 로고
    • Multiple scattering among vias in planar waveguides using preconditioned SMCG method
    • C.C. Huang, L. Tsang, C.H. Chan, and K.H. Ding, Multiple scattering among vias in planar waveguides using preconditioned SMCG method, IEEE Trans Microwave Theory Tech 52 (2004), 20-28.
    • (2004) IEEE Trans Microwave Theory Tech , vol.52 , pp. 20-28
    • Huang, C.C.1    Tsang, L.2    Chan, C.H.3    Ding, K.H.4
  • 8
    • 10944259904 scopus 로고    scopus 로고
    • Spatial domain green's functions for planar multi-layered structures
    • K.L. Lai, L. Tsang, and C.C. Huang, Spatial Domain Green's Functions for Planar Multi-layered Structures, Microwave Opt Tech Lett 44 (2005), 86-91.
    • (2005) Microwave Opt Tech Lett , vol.44 , pp. 86-91
    • Lai, K.L.1    Tsang, L.2    Huang, C.C.3
  • 11
    • 25144437691 scopus 로고    scopus 로고
    • Interconnect application note: Z-Pack HM-Zd PWB Footprint optimization for routing
    • "Interconnect application note: Z-Pack HM-Zd PWB Footprint optimization for routing, AC & D Report, #20GC015-1, Rev. A, 2001.
    • (2001) AC & D Report, #20GC015-1, Rev. A


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.