Analysis of via in multilayer printed circuit boards for high-speed digital systems

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 382-387

  Kim, Jin Ho ^a   Han, Sung Woo ^a   Kwon, Oh Kyong ^a  

^a Hanyang University   (South Korea)

Author keywords

delay; high speed digital systems; modeling; Via

Indexed keywords

CIRCUIT SIMULATION; DELAY CIRCUITS; DIGITAL COMMUNICATION SYSTEMS; MICROSTRIP LINES; MODELS; MODIFIED ATMOSPHERE PACKAGING; MULTILAYERS; PACKAGING MATERIALS; PRINTED CIRCUITS; RECONFIGURABLE HARDWARE; SPICE;

CHARACTERISTIC IMPEDANCE; DELAY; ELECTRICAL BEHAVIORS; ELECTRICAL CHARACTERISTIC; HIGH-SPEED DIGITAL SYSTEMS; HSPICE SIMULATIONS; MULTILAYER PRINTED CIRCUIT BOARD; SIGNAL INTEGRITY;

PRINTED CIRCUIT BOARDS;

EID: 84960351365     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.984014     Document Type: Conference Paper

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