Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2003, Pages 231-235

  Pak, Jun So ^a   Kim, Jingook ^a   Lee, Heejae ^b   Byun, Jung Gun ^b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Coupling; Loading effects and edge radiation; Power ground plane; Resonance; Return current; Through hole signal via

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC IMPEDANCE; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RESONANCE;

EDGE RADIATION; RETURN CURRENT; THROUGH-HOLE SIGNAL VIA;

ELECTROMAGNETIC WAVES;

EID: 0141940095     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Jin-Ho Kim, et al., 'Analysis of via in multilayer printed circuit boards for high-speed digital system', 2001. International Symposium on Electronic Materials and Packaging, 2001.
2. Qizheng Gu, et al., 'Modeling and analysis of vias in multilayered integrated circuit', IEEE Trans. On Microwave Theory and Techniques, Vol. 40, No. 2, Feb. 1993, 1993.
3. Ryosuke Ito, et al., 'GRF modeling of vertical interconnection between power-ground plane combined with 2D TLM', Electronic Performance of Electronic Packaging, 2001, 2001.
4. Constantine A. Balanis, "Antenna theory", chapter 3, 12, John Wiley famp; Sons, Inc. 1997