Multiple scattering among vias in lossy planar waveguides using SMCG method

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 2, 2002, Pages 181-188

  Huang, Chung Chi ^a   Tsang, Leung ^a   Chan, Chi H ^b  

^a University of Washington   (United States)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

O(N log N); Skin effects; SMCG; Via

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC WAVE SCATTERING; FAST FOURIER TRANSFORMS; SKIN EFFECT; WAVEGUIDES;

LOSSY PLANAR WAVEGUIDES;

PRINTED CIRCUIT BOARDS;

EID: 0036589466     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.803262     Document Type: Conference Paper

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