Mechanics-based solutions to RF MEMS switch stiction problem

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 560-567

  Mercado, Lei L ^a   Kuo, Shun Meen ^b   Lee, Tien Yu Tom ^b   Liu, Lianjun ^b  

^a MEDTRONIC   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC FIELDS; ELECTRIC POTENTIAL; ELECTROSTATICS; FINITE ELEMENT METHOD; ITERATIVE METHODS; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR SWITCHES; STICTION; THERMAL STRESS;

ACTUATION VOLTAGE; ITERATIVE COUPLED ANALYSIS; MECHANICAL PERFORMANCE; MEMS SWITCHES; SANDWICH DESIGNS;

MICROELECTROMECHANICAL DEVICES;

EID: 4444274356     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831813     Document Type: Article

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