Effect of arc behavior on material transfer: A review

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 310-322

  Chen, Zhuan Ke ^a,b   Sawa, Koichiro ^c  

^a IEEE   (United States)

^b Chugai USA Inc   (United States)

^c KEIO UNIVERSITY   (Japan)

Author keywords

Arc behavior; Arc erosion; Balance transfer; Contact morphology; Deposition; Electrical contacts; Material transfer; Sputtering

Indexed keywords

ELECTRIC ARCS; ELECTRIC CONTACTS; ELECTRIC FIELD EFFECTS; ELECTRODES; SPUTTER DEPOSITION; TEMPERATURE DISTRIBUTION;

MATERIAL TRANSFER;

ELECTRONICS PACKAGING;

EID: 0032090310     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705480     Document Type: Review

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