Thermal Solutions for Discrete and Wafer-Level RF MEMS Switch Packages

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 3, 2003, Pages 318-326

  Mercado, Lei L ^a,b   Tom Lee, Tien Yu ^a,b   Kuo, Shun Meen ^b   Hause, Vern ^b   Amrine, Craig ^b  

^a IEEE   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Discrete package; Heat dissipation; MEMS packaging; RF MEMS switch; Thermal enhancement; Wafer level

Indexed keywords

LOW TEMPERATURE EFFECTS; POWER AMPLIFIERS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; WSI CIRCUITS;

THERMAL SOLUTIONS;

MICROELECTROMECHANICAL DEVICES;

EID: 0142196115     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817962     Document Type: Article

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