A novel technique for in-plane thermal conductivity measurements of electrically conductive interconnects and nanostructures

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 564-569

  Yang, Yizhang ^a   Asheghi, Mehdi ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

Interconnects; Measurement Technique; Self heating; Thermal Conductivity

Indexed keywords

INTERCONNECTS; MEASUREMENT TECHNIQUES; SELF HEATING;

HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; NANOSTRUCTURED MATERIALS; SCATTERING; SENSITIVITY ANALYSIS; THERMAL CONDUCTIVITY; THIN FILMS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 4444226943     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)

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