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Volumn 52, Issue 16, 2004, Pages 4929-4940
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Quantitative texture analysis of free-standing electrodeposited Cu- and Ni-line patterns
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Author keywords
Electroplating; Epitaxy; Texture; Thin films; X ray diffraction
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Indexed keywords
CRYSTALLOGRAPHY;
ELECTRODEPOSITION;
ELECTROPLATING;
MICROELECTROMECHANICAL DEVICES;
MICROSTRUCTURE;
NICKEL;
POLYCRYSTALLINE MATERIALS;
TEXTURES;
THIN FILMS;
X RAY DIFFRACTION ANALYSIS;
COPPER FILMS;
CRYSTALLOGRAPHIC TEXTURES;
FIBER TEXTURES;
MICROSYSTEMS;
COPPER;
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EID: 4344651230
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2004.07.001 Document Type: Article |
Times cited : (12)
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References (43)
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