Properties of copper layers deposited by electroplating on an agglomerated copper seed layer

Electrochemical and Solid-State Letters

Volumn 5, Issue 10, 2002, Pages

  Hara, Tohru ^a   Toida, Hiroki ^a  

^a HOSEI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AGGLOMERATION; ANNEALING; BOND STRENGTH (MATERIALS); CRYSTAL ORIENTATION; DEPOSITION; ELECTROPLATING; INTERFACES (MATERIALS); PEELING; PRESSURE EFFECTS;

ADHESION STRENGTH; CHEMICAL MECHANICAL PLANARIZATION; COPPER SEED LAYER; ORIENTED COPPER CONDUCTIVE LAYER;

COPPER;

EID: 0036795920     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1506961     Document Type: Article

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