Recent advances on polymers and polymer nanocomposites for advanced electronic packaging applications

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2005, Pages

  Wong, C P ^a   Xu, J ^a   Zhu, L ^a   Li, Y ^a   Jiang, H ^a   Sun, Y ^a   Lu, J ^a   Dong, H ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE PLASTICS; CURRENT DENSITY; ELECTRONICS PACKAGING; ENCAPSULATION; FLIP CHIP DEVICES;

EMBEDDED PASSIVES; ENCAPSULANTS; WAFER LEVEL UNDERFILLS;

NANOCOMPOSITES;

EID: 42749107445     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251427     Document Type: Conference Paper

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