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Volumn 9, Issue , 2004, Pages 139-144

Formation of self assembled monolayer (SAM) on metal surfaces for high performance anisotropically conductive adhesives

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPICALLY CONDUCTIVE ADHESIVES (ACA); BALL GRID ARARYS (BGA); POLYMER MATRIX; PRINTED WRITING BOARDS (PWB);

EID: 2442587581     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (19)
  • 5
    • 0343526274 scopus 로고
    • J. Lau, Ed., (New Yrok: Van Nostrand Reinhold)
    • J. Hwang, Solder Joint Reliability, J. Lau, Ed., (New Yrok: Van Nostrand Reinhold, 1991), pp. 38.
    • (1991) Solder Joint Reliability , pp. 38
    • Hwang, J.1
  • 6
    • 0032071864 scopus 로고    scopus 로고
    • Get the lead out
    • B. Trumble, "Get the Lead Out," IEEE Spectrum, May (1998), pp.55-60.
    • (1998) IEEE Spectrum , vol.MAY , pp. 55-60
    • Trumble, B.1
  • 7
    • 51649139688 scopus 로고
    • Lead (Pb)-free solders for electronic packaging
    • S.K.Kang and A. Sarkel, "Lead (Pb)-free Solders for Electronic Packaging," Journal of Electronic Materials, Vol. 23, 1994, pp.701.
    • (1994) Journal of Electronic Materials , vol.23 , pp. 701
    • Kang, S.K.1    Sarkel, A.2
  • 8
    • 0003054755 scopus 로고
    • Evaluating polymer solders for Pb-free assembly
    • Jan.
    • K. Gilleo, "Evaluating Polymer Solders for Pb-free Assembly," Circuits Assembly, Jan. 1994, pp. 52; Feb. 1994, pp.50.
    • (1994) Circuits Assembly , pp. 52
    • Gilleo, K.1
  • 9
    • 2442633361 scopus 로고
    • Feb.
    • K. Gilleo, "Evaluating Polymer Solders for Pb-free Assembly," Circuits Assembly, Jan. 1994, pp. 52; Feb. 1994, pp.50.
    • (1994) Circuits Assembly , pp. 50
  • 10
    • 0032671484 scopus 로고    scopus 로고
    • Electrically conductive adhesives as an alternative to solder
    • Jan
    • D.J. Small, B. Eisenach, A. Lewis, and A. Babiarz, "Electrically Conductive Adhesives as an Alternative to Solder," Advanced Packaging, Jan, 1999, pp.38-42.
    • (1999) Advanced Packaging , pp. 38-42
    • Small, D.J.1    Eisenach, B.2    Lewis, A.3    Babiarz, A.4
  • 15
    • 0032090243 scopus 로고    scopus 로고
    • Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art
    • J.C. Jagt, "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2, 1998, pp.215-225.
    • (1998) IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A , vol.21 , Issue.2 , pp. 215-225
    • Jagt, J.C.1
  • 16
    • 0345979435 scopus 로고    scopus 로고
    • Formation and structure of self-assembled monolayers
    • A. Ulman, "Formation and Structure of Self-Assembled Monolayers", Chem. Rev., 96, 1996, pp.1533-1554.
    • (1996) Chem. Rev. , vol.96 , pp. 1533-1554
    • Ulman, A.1
  • 17
    • 0002950782 scopus 로고    scopus 로고
    • Self-assembled monolayers on electrodes
    • John Wiley & Sons
    • H. O. Finlea, "Self-assembled Monolayers on Electrodes", Encyclopedia of Analytical Chemistry, John Wiley & Sons, 2000, pp. 1-26.
    • (2000) Encyclopedia of Analytical Chemistry , pp. 1-26
    • Finlea, H.O.1
  • 18
    • 2442511606 scopus 로고    scopus 로고
    • Adhesion improvement of thermoplastic based isotropic conductive adhesives under humid environment by using self-assembled monolayer molecule
    • accepted
    • Kyoung-sik Moon, Chris. Rockett, and C.P. Wong, "Adhesion Improvement of Thermoplastic Based Isotropic Conductive Adhesives Under Humid Environment by Using Self-Assembled Monolayer Molecule", Journal of Adhesion Science & Technology, 2003 (accepted).
    • (2003) Journal of Adhesion Science & Technology
    • Moon, K.-S.1    Rockett, C.2    Wong, C.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.