Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *

Soldering & Surface Mount Technology

Volumn 8, Issue 3, 1996, Pages 12-18

  Vianco, P T ^a   Claghorn, A C ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Preheat treatment; Solderability; Substrate; Wettability

Indexed keywords

EID: 84986052316     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919610777708     Document Type: Article

References (16)

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