Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests

Soldering and Surface Mount Technology

Volumn 11, Issue 1, 1999, Pages 21-26

  Tuominen, Aulis ^a   Ristolainen, Eero ^a   Lehtinen, Ville ^b  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Flip chip; Flux; Surface insulation resistance; Wetting balance method

Indexed keywords

CONTAMINATION; ELECTROMIGRATION; FLUXES; INSULATION; INTERFACIAL ENERGY; PACKAGING; SOLDERING; SURFACE MOUNT TECHNOLOGY; THIN FILMS; WETTING; ELECTRIC INSULATION TESTING; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; SOLDERING ALLOYS;

FLIP CHIP (FC); FLUX; SURFACE INSULATION RESISTANCE (SIR); WETTING BALANCE METHOD; SURFACE INSULATION RESISTANCE (SIR) TESTS;

FLIP CHIP DEVICES;

EID: 0032686512     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919910254651     Document Type: Article

References (12)

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