Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-plated kovar

Journal of Electronic Materials

Volumn 32, Issue 4, 2003, Pages 254-260

  Lopez, Edwin P ^a   Vianco, Paul T ^a   Rejent, Jerome A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Au Ni plated Kovar; OFCH copper; SnAgCu solder

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; EUTECTICS; THERMAL EFFECTS; WETTING;

SOLDERABILITY TESTING;

SOLDERING ALLOYS;

EID: 0037395107     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0218-8     Document Type: Article

References (4)

1. B. Richards, An Analysis of the Current Status of Lead-Free - Update 2000 (Uxbridge, UK: Middlesex Centre for Materials and Measurement Technology, 2000).
2. Kovar is a registered trademark of Carpenter Technologies, Reading, PA.
3. P. Vianco, Solder. Surf. Mt. Technol. 24, 12 (1996).
4. R.J. Klein Wassink, Soldering in Electronics (Ayr, Scotland: Electrochemical Publications Limited, 1984), p. 235.