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Volumn , Issue , 2004, Pages 183-191

Maximum clock frequency distribution model with practical VLSI design considerations

Author keywords

[No Author keywords available]

Indexed keywords

ABERRATIONS; CLOCKS; COMPUTER SIMULATION; ELECTRIC POTENTIAL; FREQUENCIES; INTEGRATED CIRCUIT MANUFACTURE; LENSES; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; PARAMETER ESTIMATION; PROCESS CONTROL; VECTORS;

EID: 4143127818     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (17)
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  • 2
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    • K. A. Bowman, Steven G. Duvall, and J. D. Meindl, "Impact of Die-to-Die and Within-Die Parameter Fluctuations on the Maximum Clock Frequency Distribution for Gigascale Integration," IEEE J. Solid-State Circuits, pp. 183-190, Feb. 2002
    • (2002) IEEE J. Solid-state Circuits , pp. 183-190
    • Bowman, K.A.1    Duvall, S.G.2    Meindl, J.D.3
  • 5
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    • J. Tschanz, et al., "Adaptive Body Bias for Reducing Impacts of Die-to-Die and Within-Die Parameter Variations on Microprocessor Frequency and Leakage," IEEE J. Solid-State Circuits, pp. 1396-1402, Nov. 2002.
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    • The impact of intra-die device parameter variations on path delays and on the design for yield of low voltage digital circuits
    • Aug.
    • M. Eisele, J. Berthold, D. Schmitt-Landsiedel, and R. Mahnkopf, "The Impact of Intra-Die Device Parameter Variations on Path Delays and on the Design for Yield of Low Voltage Digital Circuits," in Proc. 1996 ISLPED, Aug. 1996, pp. 237-242.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.