Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 3, 1997, Pages 247-254

  Yi, Sung ^a   Goh, Jing Sua ^b   Yang, Ji Cheng ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

Effects of moisture and temperature on plastic IC packages; Hygro thermo viscoelastic analysis; Time dependent deformations and stresses and failures; TSOP

Indexed keywords

CRACK PROPAGATION; DEFORMATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT TESTING; MOISTURE; PLASTIC MOLDS; RESIDUAL STRESSES; SOLDERING; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; VISCOELASTICITY;

HYGROTHERMALLY INDUCED STRESSES; MOISTURE SOAKING TEST; THIN SMALL OUTLINE PACKAGES (TSOP);

SURFACE MOUNT TECHNOLOGY;

EID: 0031197685     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.618224     Document Type: Article

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