A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages

Microelectronics Reliability

Volumn 43, Issue 7, 2003, Pages 1105-1115

  Shi, X Q ^a   Wang, Z P ^a   Pickering, J P ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE MECHANICS; FRACTURE TOUGHNESS; STRAIN; STRESS ANALYSIS;

FILLED EPOXY FILMS;

MICROELECTRONICS;

EID: 0038113007     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00100-8     Document Type: Conference Paper

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