Role of intrinsic stresses in the phenomena of tin whiskers in electrical connectors

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 1, 2005, Pages 63-74

  Lal, Sudarshan ^a   Moyer, Thomas D ^a  

^a FCI USA Inc   (United States)

Author keywords

Electrical connectors; Lead free solder; Stress; Tin plating; Tin whiskers

Indexed keywords

COATINGS; CRYSTAL WHISKERS; DEPOSITION; LEAD; SOLDERING ALLOYS; STRESSES; SUBSTRATES; TIN; TINNING; X RAY DIFFRACTION ANALYSIS;

LEAD FREE SOLDER; TIN WHISKERS;

ELECTRIC CONNECTORS;

EID: 20344402797     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.846457     Document Type: Article

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