Preventing whiskers in electrodeposited tin for semiconductor lead frame applications

Circuit World

Volumn 30, Issue 2, 2004, Pages 20-24+5+7

  Whitlaw, Keith ^a   Egli, André ^b   Toben, Mike ^a  

^a SHIPLEY COMPANY   (United States)

^b Shipley Schweiz AG   (Switzerland)

Author keywords

Alloys; Electrodeposition; Semiconductors

Indexed keywords

CRYSTAL GROWTH; CRYSTAL ORIENTATION; ELECTRODEPOSITION; ETCHING; TEXTURES; TIN; X RAY DIFFRACTION;

CODEPOSITION; CRYSTAL PLANES;

CRYSTAL WHISKERS;

EID: 0742304521     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120410512118     Document Type: Article

References (9)

1. Britton, S.C. (1974), Spontaneous growth of whiskers on tin coatings: 20 years of observation, Transactions of the Institute of Metal Finishing, Vol. 52, pp. 95-112.
2. Egli, A., Zhang, W., Heber, J., Schwager, F. and Toben, M. (2002), Where crystal planes meet: contribution to the understanding of the tin whisker growth process, IPC Annual Meeting, New Orleans, LA.
3. Lee, B. and Lee, D.N. (1998), Spontaneous growth mechanism of tin whiskers, Acta Materialogica, Vol. 46 No. 10, pp. 3701-14.
4. Patent applied for Copper Gleam and Solderon are trademarks of Shipley Company, L.L.C.
5. RHS Directive (2003), EC Directive on Restriction of Hazardous Materials.
6. Solderon™ ST-300 acid tin, Proprietary process of Shipley Co., L.L.C., Shipley Ronal Electronic and Industrial Finishing Division, Freeport, NY, USA.
7. WEEE Directive (2003), EC Directive on Waste Electrical and Electronic Equipment.
8. Whitlaw, K.J. and Crosby, J.N. (2002), An empirical study into whisker-growth of tin and tin alloy electrodeposits, SURFIN 2002, Chicago, IL.
9. Whitlaw, K.J. and Crosby, J.N. (2003), An investigation into methods for minimising tin whisker growth, SURFIN 2003, Milwaukee, WI.