Material characterization of Cu(Ti)-polyimide thin film stacks

Thin Solid Films

Volumn 359, Issue 2, 2000, Pages 255-260

  Kondoh, E ^a  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; DEPOSITION; POLYIMIDES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; THIN FILMS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILM STACKS;

PLASTIC FILMS;

EID: 0033896650     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(99)00872-X     Document Type: Article

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