High-speed flex-circuit chip-to-chip interconnects

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 82-90

  Braunisch, Henning ^a   Jaussi, James E ^a   Mix, Jason A ^a   Trobough, Mark B ^a   Horine, Bryce D ^a   Prokofiev, Victor ^a   Lu, Daoqiang ^a   Baskaran, Rajashree ^a   Meier, Pascal C H ^a   Han, Dong Ho ^a   Mallory, Kent E ^a   Leddige, Michael W ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Chip to chip interconnects; Flex circuit; High speed connectors; High speed input output (I O); Low loss substrates

Indexed keywords

BIT ERROR RATE; CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; ELECTRIC CONNECTORS; FLIP CHIP DEVICES; INSERTION LOSSES; SUBSTRATES;

CHIP-TO-CHIP INTERCONNECT; COPPER-BASED SYSTEM-LEVEL CHANNEL; FLEX-CIRCUIT TECHNOLOGY;

INTEGRATED CIRCUITS;

EID: 40549112357     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.909451     Document Type: Article

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