High frequency/high density build-up boards with benzocyclobutene [BCB] polymer coated cu foil

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1647-1651

  Garrou, Phil ^a   So, Ying ^a   Im, Jay ^a   Ohba, Kaoru ^b   Akimoto, Hideki ^b   Kohno, Masahiko ^b   Shimoto, Tadanori ^c   Matsui, Kohji ^c   Shimada, Yuzo ^c  

^a MCNC   (United States)

^b Dow Chemical Japan Ltd   (Japan)

^c NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MODIFICATION; DIELECTRIC PROPERTIES; PLASTIC COATINGS; PLASTIC LAMINATES; RESINS;

BENZOCYCLOBUTENE; COATED COPPER FOIL;

ELECTRON DEVICE MANUFACTURE;

EID: 0034476327     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)