3D PCB architecture for next generation high speed interconnections

Circuit World

Volumn 31, Issue 4, 2005, Pages 25-33

  Fjelstad, Joseph ^a   Grundy, Kevin ^a   Yasumura, Gary ^a  

^a Silicon Pipe Inc   (United States)

Author keywords

Electronics industry; Printed circuit boards

Indexed keywords

ASSEMBLY; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; RAPID PROTOTYPING;

ARCHITECTURAL CHANGES; COPPER INTERCONNECTIONS; ELECTRONICS INTERCONNECTION INDUSTRY; HIGH SPEED INTERCONNECTIONS; PRINTED CIRCUIT BOARD ARCHITECTURE;

PRINTED CIRCUIT BOARDS;

EID: 26444611870     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120510603116     Document Type: Review

References (11)

1. Bogatin, E. (2003), Signal Integrity - Simplified, Prentice-Hall, Englewood Cliffs, NJ.
2. Camerlo, S. et al. (2004), "A cost-effective methodology for improving system signal integrity by back-drilling plated through holes in backplanes", Circuitree, November.
3. Fjelstad, J. (2004), "Rapid prototyping high speed of chip-to-chip interconnections", Global SMT & Packaging.
4. Fjelstad, J. (2004), "The X factor - 45 degree routing of interconnect on ICs", Global SMT & Packaging.
5. Fjelstad, J., Yasumura, G. and Grundy, K. (2005), "3-D partitioning of printed circuit design", Advanced Packaging.
6. Granberg, T. (2004), Handbook of Digital Techniques for High Speed Design, Prentice-Hall, Englewood Cliffs, NJ.
7. IPC (2005), National Roadmap for Electronic Interconnections.
8. Islam, S. (2004), "Overcoming the technical challenges of system-in-package (SiP)", Electronic Engineering Times, May.
9. Tummala, R. (2004), "System-on-package integrates multiple tasks", Chip Scale Review, January-February.
10. United States Patent Application 20030222282 (2003), " Direct-connect signaling system".
11. Wilson, R. (2003), "Startup takes on memory/core-logic link", Electronic Engineering Times, November.