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Volumn 2006, Issue , 2006, Pages 1853-1859

Flex-circuit chip-to-chip interconnects

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATIC TESTING; BANDWIDTH; CMOS INTEGRATED CIRCUITS; ELECTRIC CONNECTORS; ELECTRIC POTENTIAL; MICROPROCESSOR CHIPS;

EID: 33845567938     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645912     Document Type: Conference Paper
Times cited : (15)

References (13)
  • 4
    • 15944371550 scopus 로고    scopus 로고
    • Modeling and mitigating AC common mode conversion in multi-Gb/s differential printed circuit boards
    • Portland, OR, Oct. 25-27
    • H. Heck, S. Hall, B. Horine, and T. Liang, "Modeling and mitigating AC common mode conversion in multi-Gb/s differential printed circuit boards," in Proc. Topical Meeting on Electrical Perf. of Electronic Packag. (EPEP), Portland, OR, Oct. 25-27, 2004, pp. 29-32.
    • (2004) Proc. Topical Meeting on Electrical Perf. of Electronic Packag. (EPEP) , pp. 29-32
    • Heck, H.1    Hall, S.2    Horine, B.3    Liang, T.4
  • 6
    • 0029342194 scopus 로고
    • Combined differential and common-mode scattering parameters: Theory and simulation
    • July
    • D. E. Bockelman and W. R. Eisenstadt, "Combined differential and common-mode scattering parameters: Theory and simulation," IEEE Trans. Microwave Theory and Techniques, vol. 43, pp. 1530-1539, July 1995.
    • (1995) IEEE Trans. Microwave Theory and Techniques , vol.43 , pp. 1530-1539
    • Bockelman, D.E.1    Eisenstadt, W.R.2
  • 11
    • 0026711589 scopus 로고
    • An overview of elastomeric conductive polymer interconnection materials and their use in MCM technology
    • San Diego, CA, May 18-20
    • J. A. Fulton, D. D. Chang, J. R. Nis, and M. B. Schmidt, "An overview of elastomeric conductive polymer interconnection materials and their use in MCM technology," in Proc. IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May 18-20, 1992, pp. 473-480.
    • (1992) Proc. IEEE Electronic Components and Technology Conf. (ECTC) , pp. 473-480
    • Fulton, J.A.1    Chang, D.D.2    Nis, J.R.3    Schmidt, M.B.4
  • 12
    • 4444320430 scopus 로고    scopus 로고
    • Theoretical analysis of RF performance of anisotropic conductive adhesive flip-chip joints
    • Sep.
    • G. Zou, H. Gronqvist, and J. Liu, "Theoretical analysis of RF performance of anisotropic conductive adhesive flip-chip joints," IEEE Trans. Components Packaging Technologies, vol. 27, pp. 546-550, Sep. 2004.
    • (2004) IEEE Trans. Components Packaging Technologies , vol.27 , pp. 546-550
    • Zou, G.1    Gronqvist, H.2    Liu, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.