Novel microelectronic packaging method for reduced thermomechanical stresses on low dielectric constant materials

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 143-149

  Emery, Richard ^a   Towle, S ^a   Braunisch, H ^a   Hu, C ^a   Raiser, G ^a   Vandentop, G J ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MICROELECTRONICS; PERMITTIVITY; SEMICONDUCTING SILICON; THERMAL STRESS; THERMOMECHANICAL TREATMENT;

SILICON DEVICES;

CHIP SCALE PACKAGES;

EID: 0035555479     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)