The effect of melting time on lead-free solder strength

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 225-228

  Maattanen K ^a   Happonen, J ^b   Tuominen, A ^b  

^a Nursing   (Finland)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; LEAD; MELTING; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS;

ELEVATED TEMPERATURE; MELTING TIME; PULLING FORCE; PULLING TEST; REFERENCE LEVELS; REFLOW OVENS; REFLOW--SOLDERING; SOLDER JOINTS;

LEAD-FREE SOLDERS;

EID: 39449093844     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983989     Document Type: Conference Paper

References (9)

1. Wassink, R. J. K., Soldering in Electronics, Electrochemical Publications Ltd., Ayr, Scotland, 1989, p. 149-158, p. 187.
2. Turunen, J., Kinnunen, M., Lyijyttömät prosessit. Elektroniikan tuotantotekniikan pk-harjoitustyö. Elektroniikan laitos. LTKK 6.10.2000
3. Larvikko, P., Nurmi, S., Alander, T., Nykänen, J., Pienimaa, S., Ristolainen, E., Lyijytön juote Haaste ja mahdollisuus. ETX-tutkimusohjelma. www.prosessori.fi/es99/unleaded.htm.
4. Specification of Tamura soldering paste (Paste A).
5. Specification of Hereaus soldering paste (Paste B).
6. Specification of Techno Eye soldering paste (Paste C).
7. Happonen, J., Maattanen, K., Tuominen, A., "Evolving Flip Chip Fluxes", Future EMS International, Issue 1, Technology Publishing Ltd, 1999, pp. 115-118.
8. Muukkonen, E., Pirttikoski, P., Tuominen, A., "Characterization of Creep Phenomena in a Flux Junction between the IC-Device and a Copper Plated Printed Circuit Board", 6th IMAPS Nordic Annual Conference in Helsinki, Finland, 19-23 September 1999.
9. rd IEMT/IMC Symposium, Omiya, Japan, 1999, pp. 298-303.