Optimising lead-free screen-printing and reflow process parameters

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 664-668

  Ryan, Claire ^a   O'Neill, Shane ^b   Donovan, John ^b   Punch, Jeff ^a   Rodgers, Bryan ^a   Murphy, Eamonn ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b Atlantic Technological University   (Ireland)

Author keywords

Ball Grid Array (BGA) package; Cross section; Designed experiment; PWB; Reliability; Solder

Indexed keywords

BALL GRID ARRAYS (BGA); ORGANIC SOLDERABILITY PRESERVATIVE (OSP);

DATA ACQUISITION; LEAD; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

SCREEN PRINTING;

EID: 4444355653     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. The American National Safety Councils fact sheet on lead poisoning copy available from the National Safety Council, http://www.nsc.org
2. Directive 2002/96/EC and Directive 2002/95/EC of the European Parliament, copy available from the Department of Trade and Industry, http://www.dti.gov.uk
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8. th Edition, John Wiley & Sons Inc, 1997
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12. IPC-A-610 Revision C Standard, pages 12-74 - 12 - 76. Standard available from the IPC, orderipc@ipc.org.