Understanding the process window for printing lead-free solder pastes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 4, 2001, Pages 249-254

  Nguty, Tennyson A ^a   Salam, Budiman ^a   Durairaj, Rajkumar ^a   Ekere, Ndy N ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

Lead free; Rheology; Solder paste; Stencil printing; Surface mount technology; Viscosity

Indexed keywords

DENSITY (SPECIFIC GRAVITY); FLUXES; PRINTED CIRCUIT BOARDS; RHEOLOGY; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; VISCOSITY;

SOLDER PASTES; STENSIL PRINTING;

SOLDERING;

EID: 0035493806     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.980032     Document Type: Article

References (17)

1. Lead free solders for surface mount technology applications
2. Modeling of paste withdrawal sub-process in the stencil printing of solder pastes for the reflow soldering of surface mount assemblies
3. The performance of vibrating squeegee in the stencil printing of solder pastes
4. Automatic solder paste monitoring, inspection and control progress report
5. Mapping of manufacturing process modeling
6. New innovative stencil printing technology
7. Relationship between solder paste chemistry and process performance
8. Parameter Interactions in stencil printing of solder pastes
9. The behavior of solder pastes in stencil printing with a vibrating squeegee
10. Print stoke variations
11. Computer simulation of solder paste flow - Part II: Dense suspension theory
12. Computer simulation of solder paste flow - Part I: Dense suspension theory
13. The rheology and printing performance of lead-free solder pastes
14. Rheology and printability of solder paste
15. A study of the rheology and printability of solder paste
16. Implementing lead-free solder consortium research