Process control for solder paste deposition

Surface mount technology

Volumn 14, Issue 1, 2000, Pages

  Owen, Mark ^a   Hawthorne, Jeff ^a  

^a MV Technology Ltd Unit 3   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATIC TESTING; DEPOSITION; INSPECTION; INTEGRATED CIRCUIT TESTING; PROCESS CONTROL; SOLDERING; SOLDERING ALLOYS;

AUTOMATED OPTICAL INSPECTION (AOI); IN-CIRCUIT TESTS (ICT); SOLDER PASTES;

SURFACE MOUNT TECHNOLOGY;

EID: 0343932739     PISSN: 08933588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. Jeff Hawthorne, Mark Owen and Pierre Allain, "Automated Optical Inspection for SMT," EMS Magazine, Vol. 2, 1999.
2. Donald Burr, "Printing Guidelines for BGA and CSP Assemblies," SMI '98, p. 417-24.
3. Jean-Paul Clech, "Flip Chip/CSP Assembly Reliability and Solder-volume Effects," SMI '98, p. 315-23.
4. Julian Partridge and Rick Gunn, "Paste Printing and Characterization for Chip Scale Package Assemblies," SMI '98, p. 405-24.
5. I. Sterian, et al., "Compatibility of CSPs in SMT Assembly," SMI '98, p. 225-30.
6. Scott Buttars, "Stencil Printing Principles and Parameters," Future Circuits International, Issue 1, Vol. 2, 1997, p. 159-64.
7. Alan Hobby, "Printing," SMT, April 1999, p. 66-74.
8. US Patent 5,862,973, January 26, 1999 by Teradyne Inc.
9. US Patent 5,495,337, February 27, 1996 by MVP Inc.
10. US Patent 5,654,800, August 5, 1997 by GSI.
11. Patent S80748, MV Technology Ltd.