Effect of voids on thermomechanical durability of Pb-free BGA solder joints: Modeling and simulation

Journal of Electronic Packaging

Volumn 129, Issue 3, 2007, Pages 273-277

  Ladani, Leila Jannesari ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Durability; FEA; Lead free; Thermomechanical; Voids

Indexed keywords

COMPUTER SIMULATION; DURABILITY; ELECTRONIC EQUIPMENT; FINITE ELEMENT METHOD; RELIABILITY; TIN ALLOYS;

DAMAGE INITIATION; THERMOMECHANICAL DURABILITY; VOID SIZE;

SOLDERED JOINTS;

EID: 38749129114     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2753911     Document Type: Article

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