An investigation of the lead-free surface mount soldering process: Solder joint evaluation and process optimisation

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 4, Issue , 2004, Pages 187-195

  Ryan, Claire ^a   Rodgers, Bryan ^a   Punch, Jeff M ^a   Heaslip, Greg ^a   Murphy, Eamonn ^b   O'Neill, Shane ^c  

^a Stokes Research Institute   (United States)

^b UNIVERSITY OF LIMERICK   (Ireland)

^c Atlantic Technological University   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS (BGA); LEAD-FREE PRODUCTS; REFLOW PROCESS; SOLDER JOINT EVALUATION;

ELECTRONIC EQUIPMENT; MATHEMATICAL MODELS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SCREEN PRINTING; SOLDERED JOINTS; SOLDERING ALLOYS; STATISTICAL METHODS; SURFACE MOUNT TECHNOLOGY; X RAY ANALYSIS;

SOLDERING;

EID: 23244455103     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2004-60491     Document Type: Conference Paper

References (15)

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