Substrate transfer: An enabling technology for system-in-package solutions

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Volumn , Issue , 2006, Pages

  Dekker, R ^a   Dumling M ^b   Fock, J H ^c   Haartsen, J R ^d   Maas, H G R ^a   Michielsen, T M ^a   Pohlmann, H ^c   Schnitt, W ^c   Tombeur, A M H ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^c PHILIPS RESEARCH LABORATORIES   (Germany)

^d EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Bonding; Semi conductor device bonding; Semiconductor device fabrication; Silicon on insulator technology; Thermoelectric devices; Transducers

Indexed keywords

ELECTRONICS PACKAGING; POWER SUPPLY CIRCUITS; SEMICONDUCTOR DEVICES; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; TRANSDUCERS;

SEMICONDUCTOR DEVICE FABRICATION; SUBSTRATE TRANSFER TECHNOLOGY (STT); THERMOELECTRIC DEVICES;

SUBSTRATES;

EID: 39049137304     PISSN: 10889299     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/BIPOL.2006.311141     Document Type: Conference Paper

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